Kingmax has launched a new DDR3 memoy module at 2400 MHz using what you could call an invisible heatspreader. The technology is called Nano Thermal Dissipation Technology and makes the module more efficient at dealing with the heat and releasing it into the air.
Kingmax says that the new technology will not only makes modules smaller and more convenient but also lower manufacturing costs and weight, without affecting cooling. This is exemplified by the new modules operating at 2400 MHz.
The Nano Thermal Dissipation Technology adopts the nano-size thermal dissipation silicon compound to increase the release of radiant heat. The nano-size silicon compound fills up the invisible vacant space of the smooth surface to remove the surface heat more quickly. It is like a sponge, pulls the heat and releases into the air at a faster rate than normal product by it self.
How efficient Kingmax Nano Thermal Dissipation Technology really is compared to more conventional heatspreaders is hard to say, but according to the company the new technology will maintain 2℃ lower temperature than a module without NTDT or heatsink.
The memory has been tested with Intel P55, CAS 10 latencies and operating voltages between 1.5V and 1.8V. The first dual channel kit of 4 GB with 2 GB modules targets gamers and enthusiasts.
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