Santa Rosa will be the next generation Centrino platform for Intel’s mobile market and Santa Rosa looks to be introducing a whole row of interesting functions that today’s Centrino platform lacks. We’ve earlier reported about Intel’s plans to introduce its Robson technology with the Santa Rosa platform and this is something many users will appreciate. Now the site HKEPC has managed to find a number of specification sheets for the Santa Rosa platform and the content is very interesting. Except from interesting features such as HD Audio sound circuit, Gigabit Ethernet and Intel’s new DX10-capable graphics circuit GMA X3000 Intel seems to be going out strong with wireless communication.
The specifications for Santa Rosa namely contains the technologies Kedron and Windigo. Kedron is the name of the wireless network circuit which Santa Rosa will use, Kedron uses the 802.11n protocol for really high transfer rates. Windigo is another wireless chip which uses the WWAN technology (wireless wide-area networking) where there is support for both 2.5G and 3G nets. With 3G nets you can get an internet connection at up to 2.4Mbps even when you don’t have a wireless network within range.
”As SIM provides Authentication, Authorization and Accouting service for WWAN, Intel plans to apply SIM Card into Windigo to improve the security in the wireless network. Intel suggests to adding SIM Socket in mobile devices to implement Windigo technology.”
Santa Rosa really looks like an impressive platform for the mobile market and even if the paired CPU, Intel’s Merom processor, will be launched soon we will have to wait until the second quarter of 2007 before we will see Santa Rosa live with our own eyes.
